printed circuit ¦L¨î¹q¸ô
printed wiring ¦L¨î½u¸ô
printed board ¦L¨îªO
printed circuit board ¦L¨îªO¹q¸ô
printed wiring board ¦L¨î½u¸ôªO
printed component ¦L¨î¤¸¥ó
printed contact ¦L¨î±µÂI
printed board assembly ¦L¨îªO¸Ë°t
board ªO
rigid printed board è©Ê¦L¨îªO
flexible printed circuit ¼¸©Ê¦L¨î¹q¸ô
flexible printed wiring ¼¸©Ê¦L¨î½u¸ô
flush printed board »ô¥¦L¨îªO
metal core printed board ª÷Äݪä¦L¨îªO
metal base printed board ª÷Äݰò¦L¨îªO
mulit-wiring printed board ¦h«¥¬½u¦L¨îªO
molded circuit board ¼Ò¶ì¹q¸ôªO
discrete wiring board ´²½u¦L¨îªO
micro wire board ·L½u¦L¨îªO
buile-up printed board ¿n¼h¦L¨îªO
surface laminar circuit ªí±¼h¦X¹q¸ôªO
B2it printed board ®I¤J¥Y¶ô³s¦L¨îªO
chip on board ¸üªä¤ùªO
buried resistance board ®I¹qªýªO
mother board ¥ÀªO
daughter board ¤lªO
backplane IªO
bare board »rªO
copper-invar-copper board Áä½LªO§¨¤ßªO
dynamic flex board °ÊºA¼¸©ÊªO
static flex board ÀRºA¼¸©ÊªO
break-away planel ¥iÂ_«÷ªO
cable ¹qÆl
flexible flat cable (FFC) ¼¸©Ê«ó¥¹qÆl
membrane switch Á¡½¤¶}Ãö
hybrid circuit ²V¦X¹q¸ô
thick film «p½¤
thick film circuit «p½¤¹q¸ô
thin film Á¡½¤
thin film hybrid circuit Á¡½¤²V¦X¹q¸ô
interconnection ¤¬³s
conductor trace line ¾É½u
flush conductor »ô¥¾É½u
transmission line ¶Ç¿é½u
crossover ¸ó¥æ
edge-board contact ªOÃä´¡ÀY
stiffener ¼W±jªO
substrate °ò©³
real estate °òªO±
conductor side ¾É½u±
component side ¤¸¥ó±
solder side ²k±µ±
printing ¦L¨î
grid ºô®æ
pattern ¹Ï§Î
conductive pattern ¾É¹q¹Ï§Î
non-conductive pattern «D¾É¹q¹Ï§Î
legend ¦r²Å
mark ¼Ð§Ó
base material °ò§÷
laminate ¼hÀ£ªO
metal-clad bade material ÂЪ÷Äݺä°ò§÷
copper-clad laminate (CCL) Âлɺä¼hÀ£ªO
composite laminate ´_¦X¼hÀ£ªO
thin laminate Á¡¼hÀ£ªO
basis material °òÅé§÷®Æ
prepreg ¹w®û§÷®Æ
bonding sheet Ößµ²¤ù
preimpregnated bonding sheer ¹w®ûÖßµ²¤ù
epoxy glass substrate Àô®ñ¬Á¼þ°òªO
mass lamination panel ¹w¨î¤º¼hÂкäªO
core material ¤º¼hªäªO
bonding layer Ößµ²¼h
film adhesive Ößµ²½¤
unsupported adhesive film µL¤ä¼µ½¦Öß¾¯½¤
cover layer (cover lay) Âл\¼h
stiffener material ¼W±jªO§÷
copper-clad surface »Éºä±
foil removal surface ¥h»Éºä±
unclad laminate surface ¼hÀ£ªO±
base film surface °ò½¤±
adhesive faec ½¦Öß¾¯±
plate finish ì©l¥ú¼ä±
matt finish ²Ê±
length wise direction Áa¦V
cross wise direction ¼Ò¦V
cut to size panel °Å¤ÁªO
ultra thin laminate ¶WÁ¡«¬¼hÀ£ªO
A-stage resin A¶¥¾ð¯×
B-stage resin B¶¥¾ð¯×
C-stage resin C¶¥¾ð¯×
epoxy resin Àô®ñ¾ð¯×
phenolic resin ×ôîǾð¯×
polyester resin »Eà¾ð¯×
polyimide resin »E ¨ÈÓi¾ð¯×
bismaleimide-triazine resin Âù°¨¨Ó ¨ÈÓi¤T ¾ð¯×
acrylic resin ¤þ²m»Ä¾ð¯×
melamine formaldehyde resin ¤T»EÙæÓi¥ÒîǾð¯×
polyfunctional epoxy resin ¦h©x¯àÀô®ñ¾ð¯×
brominated epoxy resin ·Í¤ÆÀô®ñ¾ð¯×
epoxy novolac Àô®ñ×ôîÇ
fluroresin ¬t¾ð¯×
silicone resin Öº¾ð¯×
silane ÖºÖJ polymer »E¦Xª«
amorphous polymer µL©w§Î»E¦Xª«
crystalline polamer µ²´¹²{¶H
dimorphism Âù´¹²{¶H
copolymer ¦@»Eª«
synthetic ¦X¦¨¾ð¯×
thermosetting resin ¼ö©T©Ê¾ð¯×
thermoplastic resin ¼ö¶ì©Ê¾ð¯×
photosensitive resin ·P¥ú©Ê¾ð¯×
epoxy value Àô®ñÈ
dicyandiamide ÂùÙæÓi
binder Ößµ²¾¯
adesive ½¦Öß¾¯
curing agent ©T¤Æ¾¯
flame retardant ªý¿U¾¯
opaquer ¾B¥ú¾¯
plasticizers ¼W¶ì¾¯
unsatuiated polyester ¤£¹¡©M»Eà
polyester »EàÁ¡½¤
polyimide film (PI) »E ¨ÈÓiÁ¡½¤
polytetrafluoetylene (PTFE) »E¥|¬t¤A²m
reinforcing material ¼W±j§÷®Æ
glass fiber ¬Á¼þÅÖºû
E-glass fibre E¬Á¼þÅÖºû
D-glass fibre D¬Á¼þÅÖºû
S-glass fibre S¬Á¼þÅÖºû
glass fabric ¬Á¼þ¥¬
non-woven fabric «D´¥¬
glass mats ¬Á¼þÅÖºû¹Ô
yarn ¯½½u
filament ³æµ·
strand µ±ªÑ
weft yarn ½n¯½
warp yarn ¸g¯½
denier ¦ý¥§º¸
warp-wise ¸g¦V
thread count ´ª«¸g½n±K«×
weave structure ´ª«²Õ´
plain structure ¥¯¾²Õ´
grey fabric Ãa¥¬
woven scrim µ}ªQ´ª«
bow of weave ¤}½n
end missing Â_¸g
mis-picks ¯Ê½n
bias ½n±×
crease §é²ª
waviness ¶³Â´
fish eye ³½²´
feather length ¤ò°éªø
mark «pÁ¡¬q
split µõÁ_
twist of yarn ±É«×
size content ®û¼í¾¯§t¶q
size residue ®û¼í¾¯´Ý¯d¶q
finish level ³B²z¾¯§t¶q
size ®û¼í¾¯
couplint agent °¸Áp¾¯
finished fabric ³B²z´ª«
polyarmide fiber »E ÓiÅÖºû
aromatic polyamide paper »EªÚ ÓiÅÖºû¯È
breaking length Â_µõªø
height of capillary rise §l¤ô°ª«×
wet strength retention ·Ã±j«×«O¯d²v
whitenness ¥Õ«× ceramics ³³²¡
conductive foil ¾É¹qºä
copper foil »Éºä
rolled copper foil À£©µ»Éºä
annealed copper foil °h¤õ»Éºä
thin copper foil Á¡»Éºä
adhesive coated foil Ò\½¦»Éºä
resin coated copper foil Ò\½¦¯×»Éºä
composite metallic material ´_¦Xª÷Äݺä
carrier foil ¸üÅéºä
invar ®ï¥Ë
foil profile ºä¡]屡^½ü¹ø
shiny side ¥ú±
matte side ²ÊÁW±
treated side ³B²z±
stain proofing ¨¾ù׳B²z
double treated foil Âù±³B²z»Éºä
shematic diagram ì²z¹Ï
logic diagram ÅÞ¿è¹Ï
printed wire layout ¦L¨î½u¸ô¥¬³]
master drawing ¥¬³]Á`¹Ï
computer aided drawing pºâ¾÷»²§U¨î¹Ï
computer controlled display pºâ¾÷±±¨îÅã¥Ü
placement ¥¬§½
routing ¥¬½u
layout ¥¬¹Ï³]p
rerouting «¥¬
simulation ¼ÒÀÀ
logic simulation ÅÞ¿è¼ÒÀÀ
circit simulation ¹q¸ô¼ÒÀÀ
timing simulation ®É§Ç¼ÒÀÀ
modularization ¼Ò¶ô¤Æ
layout effeciency ¥¬½u§¹¦¨²v
MDF databse ¾÷¾¹´yz®æ¦¡¼Æ¾Ú®w
design database ³]p¼Æ¾Ú®w
design origin ³]pìÂI
optimization (design) Àu¤Æ¡]³]p¡^
predominant axis ¨Ñ³]pÀu¤Æ§¤¼Ð¶b
table origin ªí®æìÂI
mirroring Ãè¹³
drive file ÅX°Ê¤å¥ó
intermediate file ¤¤¶¡¤å¥ó
manufacturing documentation ¨î³y¤å¥ó
queue support database ¶¤¦C¤ä¼µ¼Æ¾Ú®w
component positioning ¤¸¥ó¦w¸m
graphics dispaly ¹Ï§ÎÅã¥Ü
scaling factor ¤ñ¨Ò¦]¤l
scan filling ±½´y¶ñ¥R
rectangle filling ¯x§Î¶ñ¥R
region filling ¶ñ¥R°ì
physical design ¹êÅé³]p
logic design ÅÞ¿è³]p
logic circuit ÅÞ¿è¹q¸ô
hierarchical design ¼h¦¸³]p
top-down design ¦Û³»¦V¤U³]p
bottom-up design ¦Û©³¦V¤W³]p
net ½uºô
digitzing ¼Æ¦r¤Æ
design rule checking ³]p³W«hÀˬd
router (CAD) ¨«¡]¥¬¡^½u¾¹
net list ºôµ¸ªí
subnet ¤l½uºô
objective function ¥Ø¼Ð¨ç¼Æ
post design processing (PDP) ³]p«á³B²z
interactive drawing design ¥æ¤¬¦¡¨î¹Ï³]p
cost metrix ¶O¥Î¯x°}
engineering drawing ¤uµ{¹Ï
block diagram ¤è¶ô®Ø¹Ï
moze °g®c
component density ¤¸¥ó±K«×
traveling salesman problem ¦^°â³fû°ÝÃD
degrees freedom ¦Û¥Ñ«×
out going degree ¤J«×
incoming degree ¥X«×
manhatton distance °Ò«¢¹y¶ZÂ÷
euclidean distance ¼Ú´Xùؼw¶ZÂ÷
network ºôµ¸
array °}¦C
segment ¬q
logic ÅÞ¿è
logic design automation ÅÞ¿è³]p¦Û°Ê¤Æ
separated time ¤À½u
separated layer ¤À¼h
definite sequence ©w¶¶§Ç
conduction (track) ¾É½u¡]³q¹D¡^
conductor width ¾É½u¡]Åé¡^¼e«×
conductor spacing ¾É½u¶ZÂ÷
conductor layer ¾É½u¼h
conductor line/space ¾É½u¼e«×/¶¡¶Z
conductor layer No.1 ²Ä¤@¾É½u¼h
round pad ¶ê§Î½L
square pad ¤è§Î½L
diamond pad µÙ§Î½L
oblong pad ªø¤è§Î²k½L
bullet pad ¤l¼u§Î½L
teardrop pad ²\ºw½L
snowman pad ³·¤H½L
V-shaped pad V§Î½L
annular pad Àô§Î½L
non-circular pad «D¶ê§Î½L
isolation pad ¹jÂ÷½L
monfunctional pad «D¥\¯à³s±µ½L
offset land °¾¸m³s±µ½L
back-bard land ¸¡¡]I¡^»r½L
anchoring spaur ½L§}
land pattern ³s±µ½L¹Ï§Î
land grid array ³s±µ½Lºô®æ°}¦C
annular ring ¤ÕÀô
component hole ¤¸¥ó¤Õ
mounting hole ¦w¸Ë¤Õ
supported hole ¤ä¼µ¤Õ
unsupported hole «D¤ä¼µ¤Õ
via ¾É³q¤Õ
plated through hole (PTH) Áá³q¤Õ
access hole ¾l»Ø¤Õ
blind via (hole) ª¼¤Õ
buried via hole ®I¤Õ
buried blind via ®I,ª¼¤Õ
any layer inner via hole ¥ô·N¼h¤º³¡¾É³q¤Õ
all drilled hole ¥þ³¡Æp¤Õ
toaling hole ©w¦ì¤Õ
landless hole µL³s±µ½L¤Õ
interstitial hole ¤¤¶¡¤Õ
landless via hole µL³s±µ½L¾É³q¤Õ
pilot hole ¤Þ¾É¤Õ
terminal clearomee hole ºÝ±µ¥þ»Ø¤Õ
dimensioned hole ·Ç¤Ø¤o¤Õ
via-in-pad ¦b³s±µ½L¤¤¾É³q¤Õ
hole location ¤Õ¦ì
hole density ¤Õ±K«×
hole pattern ¤Õ¹Ï
drill drawing Æp¤Õ¹Ï
assembly drawing ¸Ë°t¹Ï
datum referan °Ñ¦Ò°ò·Ç